At SOLWIT Engineering and Consultancy, we turn complex electronic system requirements into high-density, mission-critical physical hardware. Whether you supply a high-level system architectural sketch or strict physical space constraints, our engineering team handles the complete lifecycle — from concept CAD modeling and advanced SI/PI simulations to component sourcing, multi-layer PCB assembly and extreme environmental qualification. We specialize in designing and delivering rugged electronics fully qualified to Military Standards (Mil-Spec).
Our Full-Lifecycle PCB Capabilities
1. Conceptual Design & Spatial Envelope Modeling
- Spatial Envelope Constraints: We ingest your mechanical CAD files, housing restrictions, and connector orientations to map out an optimized physical PCB footprint.
- Schematic Capture & Component Selection: Robust schematics with strict component derating, active power management, and built-in hardware-level protection loops (overvoltage, reverse polarity, and ESD).
- Obsolescence Management: We source components with long lifecycles to ensure your hardware can be manufactured and supported for decades.
2. Advanced Signal Integrity (SI) & Power Integrity (PI) Analysis
To eliminate costly board spins, we subject our concept PCB CAD designs to exhaustive high-fidelity pre- and post-layout virtual simulations.
- Signal Integrity (SI): Impedance matching, crosstalk analysis, and propagation delay/flight-time matching for high-frequency communication lines.
- Power Integrity (PI): DC and AC voltage drop (IR Drop) analysis across power planes, decoupling capacitor placement optimization, and stable low-noise power delivery to critical processors, FPGAs, and gate drivers.
- Thermal Co-Simulation: Component-level heat dissipation mapping and design of optimal copper pours, thermal vias, and integrated heavy-copper planes.
3. Precision Quick-Turn Fabrication & Assembly (PCBA)
- Multi-Layer High-Density Designs: Expert layout and fabrication including high-density interconnects, blind/buried vias, and heavy-copper PCBs for high-power drive applications.
- Turnkey Component Procurement: Full supply-chain management with fully traceable components from authorized global distributors.
- Precision SMT Assembly: Automated component placement, reflow soldering, and strict automated optical inspection (AOI).
Military-Standard Validation & Testing
Our assembled PCBs undergo rigorous validation aligned with international defense protocols:
- Environmental & Thermal Stress (MIL-STD-810H): Temperature cycling, thermal shock, and high-humidity testing to prevent field failures from extreme environmental transitions.
- Shock, Impact & Vibration (MIL-STD-810H): Testing mechanical integrity against high-G ballistic shocks and continuous harmonic operational vibration profiles.
- Electromagnetic Compatibility (MIL-STD-461G): Conducted and radiated emissions/susceptibility testing to ensure electronics neither emit harmful interference nor are disrupted by external EM noise.
- Workmanship Standards (IPC-A-610 Class 3): All assembly, soldering, and inspection processes strictly adhere to IPC Class 3 criteria for high-reliability/critical-service electronic products.
Technical Specifications
| Parameter | Specifications & Standards |
|---|---|
| Layer Count | Rigids up to 16+ Layers, Rigid-Flex, and Heavy Copper Options |
| Workmanship Class | IPC-A-610 Class 3 (High-Reliability / Electronic Defense Products) |
| Testing Standards | MIL-STD-810H (Environmental), MIL-STD-461G (EMI/EMC) |
| Protective Coatings | Conformal Coating (Acrylic, Silicone, Polyurethane) & Full Potting Encapsulation |
Don't compromise on reliability when deploying electronics in extreme environments. Partner with SOLWIT to engineer, simulate, and manufacture your next generation of Mil-Spec certified PCBs.
Bring Your System Architecture to Our Team